Mattson Technology’s vision
is to become a premier supplier of capital equipment to the
integrated circuit (IC) industry by delivering innovative
solutions to our global customers. To achieve this goal, we
have developed highly focused product offerings with specific
technical expertise in rapid thermal processing (RTP), dry
strip, and etch technologies.
Creating solutions to improve the IC fabrication process
requires a combination of exacting science, engineering excellence,
and innovative design. Process steps for IC fabrication require
molecular level precision, thus each step of the wafer fabrication
process is crucial. The selection of a wafer fabrication solution
is made by scientific and empirical analysis at the wafer
level, and it is the precise “result on the wafer”
that matters the most.
Mattson Technology continues to focus on advancing the RTP,
dry strip, and etch technologies to deliver innovative solutions
for 65nm technology node and below. In RTP, our patented dual-sided
lamp technology achieves superior temperature control and
measurement. We also offer millisecond flash capability for
the formation of the most advanced transistors. In dry strip,
patented inductively-coupled plasma (ICP) technology enables
clean on-wafer results with minimum charge damage. Likewise,
etch solutions utilizing the Company’s patented inductively
coupled plasma (ICP) technology produce excellent profile
and critical dimension control with good uniformity and minimum
sputtering of the under-layer.
Through our process expertise in RTP, dry strip, and etch,
we will continue to deliver proven “results on the wafer”
and provide true value to our customers.