Mattson Technology extends its strip leadership with the introduction of SUPREMA® XP5, its latest photoresist dry strip system designed to deliver the extendibility, performance, cost of ownership (CoO) and reliability that chipmakers require for high-volume production and development of current and future-generation logic, DRAM and flash memory devices. This newest addition to the company’s complete family of best-of-breed products is based on the production-proven, vacuum-based, high-throughput SUPREMA platform and proprietary Faraday-shielded inductively coupled plasma (ICP) source technology. SUPREMA XP5 provides the most flexible and cost-effective solution for advanced front-end-of-line (FEOL) and back-end-of-line (BEOL) strip applications using oxygen-based process chemistries.
The SUPREMA XP5’s modular platform utilizes a simplified vacuum-based wafer transfer architecture designed to meet next-generation strip requirements with improved CoO, increased reliability and best-of-class particle performance. The system’s unique architecture enables faster time to production and lowers chipmakers’ total capital costs. SUPREMA XP5’s patented Faraday-shielded ICP source technology coupled with 5 kilowatt (KW) radio frequency (RF) source power provide a wider process window to achieve superior on-wafer processing results with the highest strip rates available today. Designed to address all oxygen-based strip process requirements, SUPREMA XP5 features reliable high-speed vacuum and atmospheric robotics to deliver higher productivity with throughput of greater than 430 wafers per hour . The SUPREMA XP5 is positioned to set a new benchmark for strip performance, with exceptional process flexibility, efficiency, reliability and CoO for high-volume manufacturing of advanced chips down through the 2X nanometer (nm) node.