| Engineering and technology leadership
has been the foundation of Mattson Technology’s success.
We are the global innovators of thermal and surface clean
solutions. The Company is the world leader in the dry strip
market and is the second largest supplier of RTP products.
Beginning with RTP products, our thermal solutions now include
a wide range of rapid anneals ranging from soak to spike to
millisecond flash. Our surface clean solutions are based on
a patented inductively-coupled low-damage plasma (ICP) resist
strip, coupled with dual-sided lamp heating technologies for
maximizing thermal uniformity and minimizing patterns shifts
at sub-32nm dimensions. These and other differentiating technologies
offer our customers the requisite process control capabilities
needed for manufacturing chips with ever increasing device
density and functionality. We have successfully leveraged
these two core competencies into several adjacent segment
applications such as self-aligned etch, resist etch-back and
selective oxidation of poly-silicon sidewalls. Collectively,
this diverse portfolio of technologies provides our global
customers with robust, lower-cost and timely manufacturing-worthy
process solutions.
We are committed to developing innovative process equipment
and technologies to address our customers’ unmet needs
for high productivity solutions for the consumer-driven electronics
market. Our focus on delivering “results on the wafer”
is fundamental to our philosophy of providing increasing value
to our customers. We continually strive to increase the total
value of our solutions by enabling our customers to cost-effectively
produce next generation chips with ever-greater density and
functionality.
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