Overview
Mattson Technology provides capital equipments that deliver
advanced processing capability for integrated circuit fabrication
to our customers. We are among the market leaders for RTP,
dry strip, and etch applications in both front-end-of-line
(FEOL) and back-end-of-line (BEOL) processes.
Leadership
Engineering and technology leadership has been the foundation
of Mattson Technology's success. We are the global innovators
of thermal and surface clean solutions. The Company is the
world leader in the dry strip market and is the second largest
supplier of RTP products. Beginning with RTP products, our
thermal solutions now include a wide range of rapid anneals
ranging from soak to spike to millisecond flash. Our surface
clean solutions are based on a patented inductively-coupled
low-damage plasma (ICP) resist strip, coupled with dual-sided
lamp heating technologies for maximizing thermal uniformity
and minimizing patterns shifts at sub-32nm dimensions. These
and other differentiating technologies offer our customers
the requisite process control capabilities needed for manufacturing
chips with ever increasing device density and functionality.
We have successfully leveraged these two core competencies
into several adjacent segment applications such as self-aligned
etch, resist etch-back and selective oxidation of poly-silicon
sidewalls. Collectively, this diverse portfolio of technologies
provides our global customers with robust, lower-cost and
timely manufacturing-worthy process solutions.
Vision
We are committed to developing innovative process equipment
and technologies to address our customers' evolving needs
for high productivity solutions for the consumer-driven electronics
market. Our focus on delivering "results on the wafer" is
fundamental to our philosophy of providing increasing value
to our customers. We continually strive to increase the total
value of our solutions by enabling our customers to cost-effectively
produce next generation chips with ever-greater density and
functionality |
