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Overview
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| Mattson Technology provides our
customers with equipment based on innovative technologies that
deliver advanced processing capability for front-end integrated
circuit fabrication. We are among the market leaders in our
target front-end-of-line (FEOL) markets and offer innovative
solutions for dry strip and RTP, as well as products for back-end-of-line
(BEOL) processing. Our tools, technologies and expertise are
critical enablers in the semiconductor industry's transition
to larger 300 mm wafers, sub-130 nm design rules and new materials
such as copper and low-k dielectrics. We plan to leverage our
technology and development capabilities to expand our product
offerings with the goal of increasing market share within our
target markets.
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