About Us

We design, manufacture, market and globally support semiconductor wafer processing equipment used in the fabrication of integrated circuits.

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Technology

Our manufacturing equipment for Dry Strip, Plasma Etch, Surface Treatment and Ultra-Selective Materials Removal, Rapid Thermal Processing and Millisecond Anneal utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits.

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Contact Us

Headquartered in Silicon Valley, we maintain a global infrastructure to meet the needs of our diverse customer base.

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Contact Us

We have our roots in Silicon Valley.

Corporate Headquarters

47131 Bayside Pkwy.
Fremont, CA 94538
510-657-5900
[email protected]

Worldwide Locations

Additional Contact Information:

Parts Support:
510-492-6300
[email protected]

Technical Support:
[email protected]
[email protected]

Atomic Surface Engineering™ Sales and Support:
[email protected]