Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed. The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged.
We are a leader in the dry strip market. Our strip systems offer innovative wafer handling architecture to deliver low cost of ownership for integrated circuit manufacturing.
SUPREMA® product family
Our SUPREMA family plasma dry strip and advanced patterning film removal systems have unique ICP source and twin chamber design. Each chamber is operated independently with a dedicated vacuum transfer module for maximum process flexibility and extendibility.
The SUPREMA family plasma dry strip and advanced patterning film removal systems demonstrate high process flexibility, excellent process performance, superior particulate contamination and low cost of ownership in volume production. They are tools of choice for photoresist strip and advanced patterning film removal in semiconductor device fabrications worldwide.